RESIN COMPOSITION AND MOLDING

• Main Authors: NAKAMURA TOMOYA, UEKUSA TAKAYUKI, KOSHIIO KENJI
• Format: Patent
• Language: English; Japanese
• Published: 07.02.2024
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

To provide a composition that balances conductivity with flexibility, while offering enhanced molding productivity.SOLUTION: A resin composition comprises an olefinic thermoplastic elastomer (A) and a carbon-based filler (B). When total mass of the olefinic thermoplastic elastomer (A) and the carbon-based filler (B) is 100 pts.mass, mass of the carbon-based filler (B) is 1-10 pts.mass. Following requirements (a) and (b) are satisfied: (a) volume resistance is 1×108 Ω cm or less; and (b) durometer A hardness is 80 or less.SELECTED DRAWING: None 【課題】導電性と柔軟性とが両立し、成形体の生産性にも優れる組成物を提供する。【解決手段】オレフィン系熱可塑性エラストマー（Ａ）と炭素系フィラー（Ｂ）とを、オレフィン系熱可塑性エラストマー（Ａ）と炭素系フィラー（Ｂ）との総質量１００質量部に対して炭素系フィラー（Ｂ）を１～１０質量部を含み、かつ、下記要件（ａ）および（ｂ）を満たす、樹脂組成物。要件（ａ）：体積抵抗率が１×１０8Ω・ｃｍ以下要件（ｂ）：デュロメータＡ硬度が８０以下【選択図】なし