SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD

• Main Authors: KOSAI KAZUKI, SHINOHARA KAZUYOSHI
• Format: Patent
• Language: English; Japanese
• Published: 01.02.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To prevent performance in liquid treatment from deteriorating after cleaning a substrate processing part.SOLUTION: A substrate processing device is provided with: a substrate processing part that makes a treatment liquid supply part supply treatment liquid to a placed substrate to perform a liquid treatment; a liquid ejecting part having a recovery path connected to a storage part storing the treatment liquid, and ejecting the treatment liquid used in the liquid treatment; and a control part that executes a processing recipe for the liquid treatment and a cleaning recipe for cleaning the substrate processing part and the liquid ejecting part. The liquid ejecting part has a mist guard having a first outer peripheral cylinder part and a first expanding part, a cup having a second outer peripheral cylinder part and a second expanding part, and a nozzle positioned on an upper surface of the second expanding part of the cup. The control part executes, as the cleaning recipe, cleaning operation of cleaning a lower surface of the first expanding part of the mist guard by making the nozzle supply cleaning liquid, and then executes return operation of replacing the cleaning liquid adhering to the lower surface of the first expanding part of the mist guard with the treatment liquid, by making the nozzle supply the treatment liquid that is used in the next processing recipe following the cleaning recipe.SELECTED DRAWING: Figure 6C 【課題】基板処理部を洗浄処理した後に、液処理の性能が悪化することを抑制する。【解決手段】基板処理装置は、載置された基板に処理液供給部から処理液を供給して液処理する基板処理部と、処理液を貯留する貯留部に接続される回収路を有し、液処理に使用された処理液を排液する排液部と、液処理の処理レシピと、基板処理部及び排液部を洗浄する洗浄レシピとを実行する制御部とを備える。排液部は、第１外周筒部及び第１張出部を有するミストガードと、第２外周筒部及び第２張出部を有するカップと、カップの第２張出部の上面に位置するノズルと、を有する。制御部は、洗浄レシピとして、ノズルから洗浄液を供給してミストガードの第１張出部の下面を洗浄する洗浄動作を実行した後、ノズルからかかる洗浄レシピの次の処理レシピで使用される処理液を供給してミストガードの第１張出部の下面に付着する洗浄液を処理液に置換する復帰動作を実行する。【選択図】図６Ｃ