FLUORORESIN FILM, METAL-CLAD LAMINATE AND CIRCUIT SUBSTRATE

• Main Authors: TAKAHASHI KENZO, KOMATSU NOBUYUKI, YOKOYA KOJI, HIGUCHI TATSUYA, OSHIMA KENTARO, TATEMICHI MAYUKO
• Format: Patent
• Language: English; Japanese
• Published: 01.02.2024
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING-UP

To provide a fluororesin film which is suitable for lamination with metal foil such as copper foil, and a metal-clad laminate which includes the fluororesin film.SOLUTION: A fluororesin film is composed of a fluororesin, where the number of conductive contaminants present in the film, with a length in the longitudinal or transverse direction of the film of 50 μm or more, is less than 60 per square meter.SELECTED DRAWING: None 【課題】 銅箔等の金属箔との張り合わせが良好なフッ素樹脂フィルム及びこれを使用した金属張積層体を得ることを目的とする。【解決手段】 フッ素樹脂から構成されたフィルムであって、フィルムに存在する、フィルムの流れ方向の長さもしくは幅方向の長さが５０μｍ以上の導電性異物の個数が６０個/平方メートル未満であるフッ素樹脂フィルム。【選択図】なし