FLUX AND SOLDER PASTE

To provide a flux that makes it possible to further suppress the generation of voids during soldering, and a solder paste including the flux.SOLUTION: A flux according to the present invention contains rosin, a solvent, a thixo agent, an amine hydriodide, and an active agent (other than the amine hy...

Full description

Saved in:
Bibliographic Details
Main Authors MIYAGI NANAKO, MASAKI TSUYOSHI, TAKEMASA TETSU, TAKAGI KAZUNOBU, HASHIMOTO YUTAKA, HAYAKAWA MEGUMI, KANEKO MUTSUKI, SAITO RYO, NAGAI TOMOKO
Format Patent
LanguageEnglish
Japanese
Published 01.02.2024
Subjects
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
Online AccessGet full text

Cover

More Information
Summary:To provide a flux that makes it possible to further suppress the generation of voids during soldering, and a solder paste including the flux.SOLUTION: A flux according to the present invention contains rosin, a solvent, a thixo agent, an amine hydriodide, and an active agent (other than the amine hydriodide), wherein the amine hydriodide includes a complex alicyclic amine hydriodide. As the complex alicyclic amine hydriodide, at least one selected from the group consisting of piperidine hydriodide and pipecoline hydriodide is preferable.SELECTED DRAWING: None 【課題】はんだ付けの際にボイドの発生をより抑制することができるフラックス、及びこのフラックスを用いたソルダペーストを提供する。【解決手段】本発明のフラックスは、ロジンと、溶剤と、チキソ剤と、アミンヨウ化水素酸塩と、活性剤（ただし、アミンヨウ化水素酸塩を除く）とを含有し、アミンヨウ化水素酸塩が、複素脂環式アミンヨウ化水素酸塩を含むことを特徴とする。この複素脂環式アミンヨウ化水素酸塩としては、ピペリジンヨウ化水素酸塩及びピペコリンヨウ化水素酸塩からなる群より選択される少なくとも一種が好ましい。【選択図】なし
Bibliography:Application Number: JP20220117441