COMPONENT MOUNTING EQUIPMENT

• Main Author: MORI DAICHI
• Format: Patent
• Language: English; Japanese
• Published: 01.02.2024
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

To suppress interference between already mounted components and backup pins.SOLUTION: A component mounting equipment 1 for mounting a component E on a substrate P comprises a transport unit 11 that transports the substrate P to the target stop position A, a backup pin 30 that supports the substrate P from below at the target stop position A, and a control unit 18, when the component E is already mounted on the bottom surface 55B of the substrate P, the control unit 18 changes the allowable value T of the error G of the substrate stop position relative to the target stop position A for each substrate P transported to the target stop position A or for each type of the substrate.SELECTED DRAWING: Figure 11 【課題】既実装の部品とバックアップピンの干渉を抑制する。【解決手段】基板Ｐに部品Ｅを実装する部品実装装置１は、基板Ｐを目標停止位置Ａに搬送する搬送部１１と、目標停止位置Ａにて基板Ｐを下方から支持するバックアップピン３０と、制御部１８と、を備え、制御部１８は、基板Ｐの下面５５Ｂに部品Ｅが既実装である場合、目標停止位置Ａに搬送された基板Ｐごとに、または前記基板の品種ごとに、目標停止位置Ａに対する基板停止位置の誤差Ｇの許容値Ｔを変更する。【選択図】図１１