FILM DEPOSITION DEVICE AND METHOD FOR PRODUCING FILM-COATED WAFER

• Main Authors: UEHARA TAKESHI, MIYAMOTO EIJI, KONDO HIDENORI, MATSUDA HIROKAZU, SAITO NAOMICHI
• Format: Patent
• Language: English; Japanese
• Published: 01.02.2024
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

To provide a film deposition device and a method for producing a film-coated wafer which inhibit the generation of unwanted deposits themselves, or in the event of their occurrence, securely capture the unwanted deposits to prevent or suppress the emergence of particles from the unwanted deposits, allowing for the creation of films with enhanced uniformity and homogeneity.SOLUTION: According to one aspect of the present invention, a film deposition device for forming a film on a deposition face of a wafer is provided. The film deposition device includes: a wafer holding part that holds the wafer with its deposition face downward; and a gas blowing part that blows out a film deposition gas containing the raw materials of the film to the deposition face. The wafer holding part has a structure that prevents unwanted deposits, which are formed by the reaction of the deposition gas on areas other than the deposition face, from sticking to the film on the deposition face.SELECTED DRAWING: Figure 1 【課題】不要堆積物自体の発生を抑制するか、発生したとしても不要堆積物を強固に捕捉して、不要堆積物からパーティクルが生じるのを防止又は抑制して、より均一且つ均質な膜を形成可能な成膜装置及び膜付きウェハの製造方法を提供すること。【解決手段】本発明の一態様によれば、ウェハの成膜面に膜を形成する成膜装置が提供される。この成膜装置は、成膜面を下方に向けて、ウェハを保持するように構成されたウェハ保持部と、膜の原料を含む成膜ガスを、成膜面に向けて吹出すように構成されたガス吹出部とを備える。ウェハ保持部は、成膜面以外で成膜ガスが反応することにより発生した不要堆積物が、成膜面上に形成された膜に付着するのを抑制する付着抑制構造を有する。【選択図】図１