POSITION-SELECTIVE ADHESION METHOD USING LIGHT-MELT ADHESIVE PARTICLES AND THE ADHESIVE PARTICLES

To provide light-melt adhesive particles that solve a problem of handling ability or the like in performing position-selective adhesion by using a conventional hotmelt adhesive, and a position-selective adhesion method that allows position-selective adhesion of fine location with excellent handling...

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Bibliographic Details
Main Authors FUJII HIDEJI, HIRAI TOMOYASU, YAMAMOTO NORICHIKA, NAKAMURA YOSHINOBU
Format Patent
LanguageEnglish
Japanese
Published 31.01.2024
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Summary:To provide light-melt adhesive particles that solve a problem of handling ability or the like in performing position-selective adhesion by using a conventional hotmelt adhesive, and a position-selective adhesion method that allows position-selective adhesion of fine location with excellent handling ability by using the light-melt adhesive particles.SOLUTION: Provided are light-melt adhesive particles having particles of a hotmelt adhesive and a layer of a material having a photothermal conversion function covering the particles, and a position-selective adhesion method having: an adhesive particles arranging process of arranging the light-melt adhesive particles on an adherend 1; an adhesive particles melting process of irradiating the light-melt adhesive particles with light to heat/melt particles of the hotmelt adhesive; a bonding process of bringing the light-melt adhesive particles into contact with an adherend 2 to bond them; and an adhesion process of gradually heating to solidify heated/molten adhesive particles to adhere the adherend 1 and the adherend 2 together.SELECTED DRAWING: Figure 1 【課題】従来のホットメルト接着剤を用い位置選択的接着をする際のハンドリング性等の問題を解決する光メルト接着剤粒子、及び、当該光メルト接着剤粒子を用い微細箇所の位置選択的接着を、優れたハンドリング性で可能にする位置選択的接着方法を提供する。【解決手段】ホットメルト接着剤の粒子及び前記粒子を被覆する光熱変換能を有する材料の層を有する光メルト接着剤粒子、及び、被接着体1上にその光メルト接着剤粒子を配置する接着剤粒子配置工程、前記光メルト接着剤粒子に光照射して前記ホットメルト接着剤の粒子を加熱溶融させる接着剤粒子溶融工程、前記光メルト接着剤粒子と被接着体2とを接触させ接合する接合工程、及び加熱溶融した接着剤粒子を徐熱し固化して、被接着体1及び被接着体2を接着させる接着工程を有する位置選択的接着方法。【選択図】 図1
Bibliography:Application Number: JP20220114485