METHOD FOR MANUFACTURING LAMINATE

• Main Authors: UEDA HIROSHI, KIMURA ATSUSHI, YAMAGUCHI YOSHIHITO, MIURA KOSUKE, OKAMOTO KOHEI
• Format: Patent
• Language: English; Japanese
• Published: 30.01.2024
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

To provide a printed wiring board which has comparatively high wiring density and is excellent in insulating property between wires, and a method for manufacturing the same.SOLUTION: A method for manufacturing a laminate having a layer of a synthetic resin film and a layer of an insulating film includes an overlapping step of overlapping the insulating film on at least one surface side of the synthetic resin film, and a vacuum heating pressing step of vacuum heating pressing the laminate obtained by laminating the insulating film, in which a heating temperature in the vacuum heating pressing step is 50°C or higher and 150°C or lower, pressurization time is 5 seconds or longer and 20 seconds or shorter, and a pressing pressure is 0.3 MPa or more and 1.3 MPa or less.SELECTED DRAWING: Figure 1 【課題】配線密度が比較的高く、かつ配線間の絶縁性に優れるプリント配線板、及びその製造方法を提供する。【解決手段】合成樹脂フィルムの層と絶縁性フィルムの層とを備える積層体の製造方法であって、上記合成樹脂フィルムの少なくとも一方の面側に上記絶縁性フィルムを重ね合わせる重ね合わせ工程と、上記絶縁性フィルムを重ね合わせた積層体を真空加熱プレスする真空加熱プレス工程とを備え、上記真空加熱プレス工程での加熱温度が５０℃以上１５０℃以下であり、加圧時間が５秒以上２０秒以下であり、プレス圧力が０．３ＭＰａ以上１．３ＭＰａ以下である積層体の製造方法。【選択図】図１