MANUFACTURING METHOD OF WIRING BOARD

To improve quality of a wiring board.SOLUTION: A manufacturing method of a wiring board includes: forming a seed layer 12 in an insulation layer 10 containing a resin and a filler; forming a pattern plated layer (for example, wiring pattern layer 14) on the seed layer 12; thinning the thickness of t...

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Bibliographic Details
Main Author KADOWAKI YUJI
Format Patent
LanguageEnglish
Japanese
Published 25.01.2024
Subjects
APPARATUS THEREFOR
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
PRINTED CIRCUITS
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Summary:To improve quality of a wiring board.SOLUTION: A manufacturing method of a wiring board includes: forming a seed layer 12 in an insulation layer 10 containing a resin and a filler; forming a pattern plated layer (for example, wiring pattern layer 14) on the seed layer 12; thinning the thickness of the seed layer 12 exposed from the pattern plated layer by one etching out of wet etching and dry etching; and removing the seed layer 12 which is exposed from the pattern plated layer by etching different from etching of thinning the thickness of the seed layer 12 out of the wet etching and the dry etching, and thins its thickness.SELECTED DRAWING: Figure 1E 【課題】配線基板の品質向上。【解決手段】一実施形態の配線基板の製造方法は、樹脂及びフィラーを含有する絶縁層１０にシード層１２を形成すること、シード層１２上にパターンめっき層（例えば配線パターン層１４）形成すること、エットエッチング又はドライエッチングのうち、一方のエッチングによりパターンめっき層から露出するシード層１２の厚みを薄くすること、ウエットエッチング又はドライエッチングのうち、シード層１２の厚みを薄くするエッチングとは異なるエッチングによりパターンめっき層から露出し、厚みが薄くなったシード層１２を除去すること、を有する。【選択図】図１Ｅ
Bibliography:Application Number: JP20220114269