MEMBER FOR RESISTOR, PRODUCTION METHOD THEREOF, AND RESISTOR
To provide a member for a resistor, which is superior in bendability of a junction, and which enables the suppression of production of burr from the surface of the junction and the reduction of a rate of a resistance change to a temperature change, a production method thereof, and a resistor.SOLUTIO...
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Main Authors | , , , , , |
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Format | Patent |
Language | English Japanese |
Published |
24.01.2024
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Subjects | |
Online Access | Get full text |
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Summary: | To provide a member for a resistor, which is superior in bendability of a junction, and which enables the suppression of production of burr from the surface of the junction and the reduction of a rate of a resistance change to a temperature change, a production method thereof, and a resistor.SOLUTION: A member for a resistor comprises a first metal member 10 and a second metal member 20 which are joined to each other through a junction 30. The first metal member contains Cu of 99.96 mass% or more. The second metal member contains Cu of 83.00 mass% or more and 94.00 mass% or less. In a cross section perpendicular to a welding line 2, a junction width ratio (w1/w) is 1.70 or more and 2.30 or less, and a junction width ratio (w2/w) is 0.60 or more and 1.15 or less, where w1 is a first junction width of the junction in a first surface 31 of the junction, w2 is a second junction width of the junction in a second surface 32 of the junction opposed to the first surface, and w is a thickness-intermediary portion junction width of the junction in a thickness-intermediary portion 33 located between the first surface and the second surface.SELECTED DRAWING: Figure 2
【課題】接合部の曲げ性に優れ、接合部表面からのバリの発生を抑制し、温度変化に対する抵抗値変化率を減少した抵抗器用部材、抵抗器用部材の製造方法、および抵抗器を提供する。【解決手段】第1金属部材10と第2金属部材20とが接合部30を介して接合されてなる抵抗器用部材であって、前記第1金属部材は、Cuを99.96質量%以上含有し、前記第2金属部材は、Cuを83.00質量%以上94.00質量%以下含有し、溶接線2に垂直な断面において、前記接合部の第1表面31における前記接合部の第1接合幅をw1とし、前記第1表面に対向する前記接合部の第2表面32における前記接合部の第2接合幅をw2とし、前記第1表面と前記第2表面との中間に位置する厚さ中間部33における前記接合部の厚さ中間部接合幅をwとすると、接合幅比(w1/w)は1.70以上2.30以下、かつ、接合幅比(w2/w)は0.60以上1.15以下である。【選択図】図2 |
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Bibliography: | Application Number: JP20220112034 |