RESIN MATERIAL AND MULTILAYER PRINTED WIRING BOARD

• Main Authors: BABA SUSUMU, HAYASHI TATSUJI, MIZUNO KATSUTOSHI
• Format: Patent
• Language: English; Japanese
• Published: 19.01.2024
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

To provide a resin material which can reduce a dielectric loss tangent, and can suppress generation of delamination.SOLUTION: A resin material contains an epoxy compound, an inorganic filler, a curing agent, and a silane coupling agent having a triazine skeleton, wherein a specific surface area of the inorganic filler is 1 m2/g or more and 50 m2/g or less.SELECTED DRAWING: Figure 1 【課題】誘電正接を低くすることができ、かつデラミネーションの発生を抑えることができる樹脂材料を提供する。【解決手段】本発明に係る樹脂材料は、エポキシ化合物と、無機充填材と、硬化剤と、トリアジン骨格を有するシランカップリング剤とを含み、前記無機充填材の比表面積が、１ｍ２／ｇ以上５０ｍ２／ｇ以下である。【選択図】図１