ELECTRONIC DEVICE

To provide an electronic device with a metal member having a roughened region covered with sealing resin capable of ensuring close contact between the metal member and the sealing resin, while reducing warpage and the area of the roughened region.SOLUTION: Around an area 3C of a lead frame 3, where...

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Bibliographic Details
Main Author OSHIMA MASANORI
Format Patent
LanguageEnglish
Japanese
Published 17.01.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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