SUBSTRATE PROCESSING METHOD

• Main Author: NAKAI HITOSHI
• Format: Patent
• Language: English; Japanese
• Published: 11.01.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To facilitate the lifting and lowering of a chuck, and the gripping and release of a substrate by the chuck.SOLUTION: A substrate W includes a first surface W1, and a second surface W2 closer to a chuck base 11 than the first surface W1. In a first step, a processing liquid is supplied to at least o...