PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, PATTERNED CURED FILM, AND SEMICONDUCTOR ELEMENT

• Main Authors: HAMANO YOSHIMI, AOKI MASARU
• Format: Patent
• Language: English; Japanese
• Published: 11.01.2024
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; ELECTROGRAPHY; HOLOGRAPHY; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MATERIALS THEREFOR; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; THEIR PREPARATION OR CHEMICAL WORKING-UP

To provide a photosensitive resin composition that offers the capability for fine processing with high resolution and can form a cured film with superior mechanical strength.SOLUTION: A photosensitive resin composition includes (A) an alkali-soluble resin with a phenolic hydroxy group, (B) a compound with sulfonate at the 4-position, which produces acid upon exposure to light, and (C) a compound with an alkoxy or epoxy group, which induces a crosslinking reaction through heat. Such a photosensitive resin composition has high resolution and superior mechanical strength. The addition of (D) an elastomer may improve both heat resistance and mechanical strength.SELECTED DRAWING: None 【課題】高解像度の微細加工性能を有し、かつ、優れた機械強度を持つ硬化膜を形成可能な感光性樹脂組成物を提供する。【解決手段】（Ａ）フェノール性水酸基を有するアルカリ可溶性樹脂と、（Ｂ）光により酸を生成する４位にスルホン酸エステルを有する化合物と、（Ｃ）アルコキシ基又はエポキシ基を有する熱により架橋反応が生じる化合物と、を含有する感光性樹脂組成物は高解像度で機械強度が優れ、更に（Ｄ）エラストマを含有させると耐熱性、機械強度がより向上する。【選択図】なし