JOINING PASTE AND JOINT BODY

• Main Authors: UESUGI TAKAHIKO, TANAKA NAOHIRO
• Format: Patent
• Language: English; Japanese
• Published: 05.01.2024
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CASTING; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MAKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; PERFORMING OPERATIONS; POLISHES; POWDER METALLURGY; SEMICONDUCTOR DEVICES; TRANSPORTING; USE OF MATERIALS AS ADHESIVES; WORKING METALLIC POWDER

To provide a joining paste that exhibits high joint strength in the joined area and demonstrates reduced susceptibility to the deterioration of joint strength due to thermal cycling; a joining paste that, in addition to these characteristics, ensures excellent printability on the joined part, even when containing a high concentration of metal particles; and a joint body that is less prone to degradation due to thermal cycling.SOLUTION: A joining paste includes metal particles (A) with an average particle size of 100 nm-500 nm, a C20-80 compound (B) with two or more functional groups (b) selected from hydroxy groups, carboxy groups and amino groups, and a dispersion medium (C) with a boiling point of 200°C or higher. There is also provided a joint body where a first joint part and a second joint part are joined together using the joining paste.SELECTED DRAWING: None 【課題】接合された箇所の接合強度が高く、冷熱サイクルに伴う接合強度の低下が抑制された接合用ペーストを提供すること。また、上記特性に加えて、高濃度に金属粒子を含有していても被接合体部への印刷適性に優れる接合用ペーストを提供すること。さらに、冷熱サイクルによって劣化しない接合体を提供すること。【解決手段】上記課題は、平均粒子径が１００ｎｍ～５００ｎｍである金属粒子（Ａ）と、水酸基、カルボキシ基及びアミノ基から選ばれるいずれか一種である官能基（ｂ）を２つ以上有する炭素数２０～８０の化合物（Ｂ）と、沸点が２００℃以上である分散媒（Ｃ）と、を含有してなる接合用ペースト、並びに、該接合用ペーストによって、第一の被接合部と第二の被接合部とが接合された接合体によって解決される。【選択図】なし