PRINTED CIRCUIT BOARD

• Main Author: LEE KYE HWAN
• Format: Patent
• Language: English; Japanese
• Published: 28.12.2023
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

To provide a printed circuit board capable of reducing the thickness.SOLUTION: A printed circuit board has: a first insulating layer; a first pad buried in one surface side of the first insulating layer and whose one surface is exposed from the one surface of the first insulating layer; and a first surface processing layer arranged on the exposed one surface of the first pad. A boundary surface between the first pad and the first surface processing layer is on the same plane as the one surface of the first insulating layer.SELECTED DRAWING: Figure 3 【課題】厚さを節減することができるプリント回路基板を提供する。【解決手段】本発明によるプリント回路基板は、第１絶縁層と、第１絶縁層の一面側に埋め込まれ、一面が第１絶縁層の一面から露出した第１パッドと、第１パッドの露出した一面上に配置される第１表面処理層と、を有し、第１パッドと第１表面処理層との境界面は、第１絶縁層の一面と同一平面上にある。【選択図】図３