ADHESIVE TAPE FOR LASER DICING

• Main Authors: SUZUKI KYOICHI, SOGABE ATSUSHI
• Format: Patent
• Language: English; Japanese
• Published: 28.12.2023
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; USE OF MATERIALS AS ADHESIVES

To provide an adhesive tape for laser dicing which has good water permeability of water jet at the time of dicing, can suppress chip scattering due to a water flow, and leaves no paste residue in divided chips at the time of picking up, in laser dicing for guiding a laser beam by water jet.SOLUTION: There is provided an adhesive tape in which a base material, and an adhesive layer and a separator film are sequentially stacked on one surface of the base material, wherein the base material is a curable resin film obtained by curing an ionizing radiation-curable composition, and has a through hole in a thickness direction.SELECTED DRAWING: Figure 1 【課題】レーザーがウォータージェットでガイドされるレーザーダイシングにおいて、ダイシング時のウォータージェットの水透過性が良く、水流によるチップ飛びを抑制でき、さらに個片化したチップのピックアップ時にチップへの糊残りがないレーザーダイシング用粘着テープを提供する。【解決手段】基材と、前記基材の一方の面の上に粘着剤層とセパレータフィルムとを順次積層した粘着テープであって、前記基材は、電離放射線硬化性樹脂組成物を硬化させてなる硬化樹脂フィルムであり、且つ厚さ方向に貫通孔を有しているものとする。【選択図】図１