NOZZLE POSITION ADJUSTMENT METHOD AND SUBSTRATE PROCESSING DEVICE

• Main Authors: MURAMOTO RYO, NEMOTO SHUHEI, NAKAJIMA AKIHIRO
• Format: Patent
• Language: English; Japanese
• Published: 28.12.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a nozzle position adjustment method and a substrate processing device that can adjust a liquid supply position with high precision.SOLUTION: The total value of a first distance by which a nozzle travels from the separated position until the engagement surface comes into contact with the end surface of a jig plate and a second distance required to move the nozzle in a posture in which the engagement surface is in contact with the end surface of the jig plate along the radial direction to the processing position is calculated as the nozzle movement distance. Then, when substrate processing is performed, the nozzle is positioned at the processing position by moving the nozzle from the separated position by the nozzle movement distance.SELECTED DRAWING: Figure 9 【課題】液供給位置を高精度に調整することができるノズル位置調整方法および基板処理装置を提供する。【解決手段】この発明は、離間位置から係合面が治具板の端面に当接するまでにノズルが移動した第１距離と、係合面が治具板の端面に当接した姿勢のノズルを処理位置まで径方向に沿って移動させるのに要する第２距離とを合計した値をノズル移動距離として求める。そして、基板処理を実行する際には、ノズルを離間位置からノズル移動距離だけ移動させることで、ノズルを処理位置に位置決めする。【選択図】図９