POLYIMIDE LAMINATED FILM

• Main Authors: SAWAZAKI KOICHI, NAKAGAMI ATSUTAKA, GOTO YOSHINORI
• Format: Patent
• Language: English; Japanese
• Published: 26.12.2023
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PERFORMING OPERATIONS; PRINTED CIRCUITS; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; TRANSPORTING

To provide a novel polyimide laminated film.SOLUTION: The problem is solved by having a polyimide laminated film that has a polyimide layer (II) provided on one or both sides of a polyimide layer (I) and in which Tg of the polyimide layer (II) is 300°C or less.SELECTED DRAWING: None 【課題】新規なポリイミド積層フィルムを提供することを目的とする。【解決手段】ポリイミド積層フィルムを、ポリイミド層（Ｉ）の片面又は両面にポリイミド層（ＩＩ）を設けたポリイミド積層フィルムであって、ポリイミド層（ＩＩ）のＴｇが３００℃以下のものとする。【選択図】なし