CURABLE COMPOSITION, CURED PRODUCT OF THE COMPOSITION, METHOD FOR PRODUCING THE COMPOSITION AND THE CURED PRODUCT, AND SEMICONDUCTOR DEVICE

• Main Authors: SATO TATSUKI, KOMATA AYUMI, MIZUNO KATSUTOSHI
• Format: Patent
• Language: English; Japanese
• Published: 25.12.2023
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

To provide a curable composition that yields a cured product having low dielectric properties while having superior solder heat resistance, and a cured product thereof, and methods for producing the curable composition and the cured product, and a semiconductor device that employs the cured product as a sealant.SOLUTION: A curable composition includes (A) a benzoxazine compound, (B) an epoxy compound, and (C) a polyphenylene ether compound.SELECTED DRAWING: None 【課題】はんだ耐熱性に優れながら、低誘電特性を有する硬化物を得るための硬化性組成物、その硬化物、ならびに該硬化性組成物および該硬化物の製造方法を提供する。また、前記硬化物を封止材として用いた半導体装置を提供する。【解決手段】本発明の硬化性組成物は、（Ａ）ベンゾオキサジン化合物と、（Ｂ）エポキシ化合物と、（Ｃ）ポリフェニレンエーテル化合物とを含有する。【選択図】なし