FLEXIBLE WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

To provide a flexible wiring board which is applicable to fine wiring by a conductive thin film having high flexibility and conductivity.SOLUTION: A flexible wiring board includes a freely flexible resin substrate 2, a flexible layer 3 which is freely flexibly provided on the flexible resin substrat...

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Bibliographic Details
Main Authors NAKADA MITSURU, MIYAKAWA MIKIJI, TSUJI HIROSHI
Format Patent
LanguageEnglish
Japanese
Published 25.12.2023
Subjects
BASIC ELECTRIC ELEMENTS
CABLES
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CONDUCTORS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INSULATORS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
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Summary:To provide a flexible wiring board which is applicable to fine wiring by a conductive thin film having high flexibility and conductivity.SOLUTION: A flexible wiring board includes a freely flexible resin substrate 2, a flexible layer 3 which is freely flexibly provided on the flexible resin substrate 2, and a conductive thin film 4 provided on the flexible layer 3, wherein a fine uneven structure 5 having irregularity is provided on the surface of the flexible layer 3.SELECTED DRAWING: Figure 2 【課題】高い伸縮性と導電性とを兼ね備えた導電性薄膜によって微細な配線への適用を可能とした伸縮性を有する配線基板を提供する。【解決手段】伸縮自在な伸縮性樹脂基板２と、伸縮性樹脂基板２の面上に伸縮自在に設けられた伸縮層３と、伸縮層３の面上に設けられた導電性薄膜４とを備え、伸縮層３の表面には、不規則性を有する微細な凹凸構造５が設けられている。【選択図】図２
Bibliography:Application Number: JP20220095158