POLYIMIDE RESIN COMPOSITION AND CURED PRODUCT THEREOF

• Main Authors: NISHIMURA KENGO, NAGASHIMA NORIYUKI, SASAKI TOMOE
• Format: Patent
• Language: English; Japanese
• Published: 20.12.2023
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

To provide a resin composition that yields a cured product having superior substrate adhesion, mechanical characteristics, and heat resistance and is suitable for use in a printed wiring board.SOLUTION: A resin composition includes a copolymer of an unsaturated monomer including styrene and maleic anhydride (A), a soluble polyimide resin (B), a maleimide resin (C), and a curing accelerator (D). Relative to the total of the components (A) to (C), the content of the component (A) is 1.0 to 70 mass%. Relative to the total of the components (A) to (C), the content of the component (B) is 20 to 90 mass%. There are also provided a cured product of the resin composition and an article including the cured product.SELECTED DRAWING: None 【課題】硬化物が基材接着性、機械特性、耐熱性に優れ、プリント配線板に好適に用い得る樹脂組成物を提供すること。【解決手段】スチレンと無水マレイン酸を含む不飽和単量体の共重合体（Ａ）、可溶性ポリイミド樹脂（Ｂ）、マレイミド樹脂（Ｃ）及び硬化促進剤（Ｄ）を含む樹脂組成物であって、（Ａ）乃至（Ｃ）成分の合計に対する（Ａ）成分の含有量が１．０乃至７０質量％であり、かつ（Ａ）乃至（Ｃ）成分の合計に対する（Ｂ）成分の含有量が、２０乃至９０質量％である樹脂組成物、該樹脂組成物の硬化物及び該硬化物を備えた物品。【選択図】なし