CATHODE, HIGH SPEED ATOMIC BEAM SOURCE, METHOD OF MANUFACTURING BONDED SUBSTRATE, AND METHOD OF REGENERATING CATHODE
To provide a cathode, a high speed atomic beam source, and the like, which are capable of suppressing the release of particle deposits from the high speed atomic beam source and also suppressing the reduction of the degree of vacuum in the high speed atomic beam source.SOLUTION: A cathode 100 of a h...
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Main Author | |
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Format | Patent |
Language | English Japanese |
Published |
18.12.2023
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Subjects | |
Online Access | Get full text |
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Summary: | To provide a cathode, a high speed atomic beam source, and the like, which are capable of suppressing the release of particle deposits from the high speed atomic beam source and also suppressing the reduction of the degree of vacuum in the high speed atomic beam source.SOLUTION: A cathode 100 of a high speed atomic beam source has six inner surfaces 110-160. The inner surfaces comprise six flat cathode members 103, and are provided with an inert gas introduction port 102 to introduce inert gas into the cathode and a particle beam emission port 101 to emit high speed atomic beams to the outside of the cathode, and have an adhesive covered area on planes of the cathode members. The adhesive covered area is an area where a re-attachment amount of sputter dust caused by a sputtering phenomenon is larger than a removal amount of the cathode members by the sputtering phenomenon caused by the use of the high speed atomic beam source. A volume ratio of a volume of an adhesive is 1-15% relative to an internal volume of the cathode, and a paste area of an adhesive material 104 is 25% or more on an adhesive surface of the inside of the cathode in the adhesive covered area.SELECTED DRAWING: Figure 3
【課題】高速原子ビーム線源からのパーティクル堆積物の放出を抑制でき、かつ、高速原子ビーム線源内の真空度の低下を抑制する陰極、高速原子ビーム線源等を提供する。【解決手段】高速原子ビーム線源の陰極100は、6つの内面110~160を有する。内面は、6枚の平板状の陰極部材103から構成され、陰極内に不活性ガスを導入する不活性ガス導入口102と、陰極の外部に高速原子ビームを放出する粒子線放出口101が設けられており、陰極部材の平面に、粘着剤被覆領域を有する。粘着剤被覆領域は、高速原子ビーム線源の使用により発生するスパッタリング現象による陰極部材の除去量よりも、スパッタリング現象により発生したスパッタ塵の再付着量の方が大きい領域であり、粘着剤の体積は、陰極の内部の体積に対して、体積割合1%~15%であり、粘着剤被覆領域の陰極の内部に対する接着面において、粘着材104の貼付面積が25%以上である。【選択図】図3 |
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Bibliography: | Application Number: JP20220091877 |