PASSIVE COMPONENT, THREE DIMENSIONAL DEVICE, AND METHOD FOR MANUFACTURING PASSIVE COMPONENT

• Main Author: YOSHIOKA YOSHIMASA
• Format: Patent
• Language: English; Japanese
• Published: 14.12.2023
• Subjects: BASIC ELECTRIC ELEMENTS; CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INDUCTANCES; MAGNETS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES; SEMICONDUCTOR DEVICES; TRANSFORMERS

To provide passive components that can reduce the overall thickness of devices such as stacked semiconductor packages.SOLUTION: A passive component has a body part having a first major surface and a passive element at least partially provided inside the body part, and the first major surface includes a flat surface at least partially made of an inorganic material and having a surface roughness of less than 1/1000 of the thickness of the body part or 10 nm in a direction orthogonal to the first major surface.SELECTED DRAWING: Figure 1 【課題】積層型半導体パッケージなどのデバイス全体の薄型化を図ることができる、受動部品を提供する。【解決手段】受動部品は、第１主面を有する本体部と、少なくとも一部が前記本体部の内部に設けられた受動素子と、を備え、前記第１主面は、少なくとも一部に無機物からなり且つ表面粗さが前記第１主面に直交する方向における前記本体部の厚みの１０００分の１以下又は１０ｎｍ以下となる平坦面を含む。【選択図】図１