TEMPORARY FIXING LAMINATE, TEMPORARY FIXING LAMINATE FILM, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

• Main Authors: ENOMOTO TETSUYA, MIYAZAWA EMI, INOUE YUKIKO, AKASU YUTA
• Format: Patent
• Language: English; Japanese
• Published: 13.12.2023
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; PERFORMING OPERATIONS; POLISHES; SEMICONDUCTOR DEVICES; TRANSPORTING; USE OF MATERIALS AS ADHESIVES

To provide a temporary fixing laminate film and a temporary fixing laminate that can be suitably used in a method for manufacturing a semiconductor device that includes a step of processing a semiconductor member temporarily fixed to a support member, and can separate a processed semiconductor component from the support component with lower light irradiation energy.SOLUTION: A temporary fixing laminate 20 is used for temporarily fixing a semiconductor member and a support member. The temporary fixing laminate 20 includes a support member 22, and a temporary fixing material layer 10A provided on the support member 22, and the temporary fixing material layer 10A includes a first curable resin layer 14, a metal layer 12, and a second curable resin layer 16 in this order starting from the support member 22. The thickness of the metal layer 12 is 1 μm or more. The thickness of the second curable resin layer 16 is 2 to 10 times the thickness of the first curable resin layer 14.SELECTED DRAWING: Figure 2 【課題】支持部材に対して仮固定された半導体部材を加工する工程を備える半導体装置の製造方法に好適に用いることができ、より低い光照射エネルギーで、加工後の半導体部材を支持部材から分離することが可能な仮固定用積層フィルム及び仮固定用積層体を提供すること。【解決手段】半導体部材と支持部材とを仮固定するために用いられる仮固定用積層体２０が提供される。当該仮固定用積層体２０は、支持部材２２と、支持部材２２上に設けられた仮固定材層１０Ａとを備える。仮固定材層１０Ａは、第１の硬化性樹脂層１４と、金属層１２と、第２の硬化性樹脂層１６とを支持部材２２からこの順に有する。金属層１２の厚さは、１μｍ以上である。第２の硬化性樹脂層１６の厚さは、第１の硬化性樹脂層１４の厚さに対して２～１０倍である。【選択図】図２