MANUFACTURING METHOD OF CIRCUIT CONNECTION STRUCTURE AND CIRCUIT CONNECTION DEVICE

• Main Authors: MORIJIRI TOMOKI, ITO YUKA, SATO MAYUMI, IZAWA HIROYUKI
• Format: Patent
• Language: English; Japanese
• Published: 13.12.2023
• Subjects: BASIC ELECTRIC ELEMENTS; CABLES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CONDUCTORS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INSULATORS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; SEMICONDUCTOR DEVICES

To provide a method of manufacturing a circuit connection structure which reduces a crack of an inter-electrode connection part generated when using solder in a connection material between opposite electrodes by thermally compressing circuit members.SOLUTION: A manufacturing method of a circuit connection structure 40 comprises: a step (a) of arranging a circuit connection material having a solder connection material 1 and an adhesive on a surface on which a first electrode 12 of a first circuit member 10 having the first electrode is formed; a step (b) of arranging a second circuit member 20 having a second electrode 22 on the first circuit member such that the first electrode and the second electrode are opposed to each other; a step of thermally compressing the first circuit member and the second circuit member at a temperature equal to or greater than a melting point of the solder connection material in such a state that the solder connection material is interposed between the first electrode and the second electrode; and a step of performing cooling while pressurizing a space between the first electrode and the second electrode until the temperature between the first electrode and the second electrode becomes the temperature equal to or less than the melting point of the solder connection material from the temperature equal to or greater than the melting point of the solder connection material.SELECTED DRAWING: Figure 2 【課題】回路部材同士を熱圧着することにより対向電極間の接続材料にはんだを使用する際に発生する電極間接続部のクラックを低減する回路接続構造体を製造する方法を提供する。【解決手段】回路接続構造体４０の製造方法は、第一の電極１２を有する第一の回路部材１０の第一の電極が形成されている面上にはんだ接続材１及び接着剤を備える回路接続材を配置する工程（ａ）と、第二の電極２２を有する第二の回路部材２０を、第一の電極と第二の電極とが相対向するように、第一の回路部材上に配置する工程（ｂ）と、第一の電極と第二の電極との間にはんだ接続材が介在する状態で、第一の回路部材と第二の回路部材とをはんだ接続材の融点以上の温度で熱圧着する工程と、第一の電極と第二の電極との間の温度がはんだ接続材の融点以上の温度からはんだ接続材の融点以下の温度となるまで、第一の電極と第二の電極との間を加圧しながら冷却する工程と、を備える。【選択図】図２