RADIATION-RESISTANT CAMERA AND RADIATION-RESISTANT CAMERA SYSTEM

To provide a radiation-resistant camera including a compact and lightweight camera head and having improved radiation resistance through heat processing, while suppressing reduction in device service life and increase in the amount of dark current in an image sensor.SOLUTION: A radiation-resistant c...

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Bibliographic Details
Main Authors UENO KATSUNOBU, KUWANA RYO, HIRANO KATSUHIKO, MASUNAGA MASAHIRO, NOMOTO SHINJI
Format Patent
LanguageEnglish
Japanese
Published 13.12.2023
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Summary:To provide a radiation-resistant camera including a compact and lightweight camera head and having improved radiation resistance through heat processing, while suppressing reduction in device service life and increase in the amount of dark current in an image sensor.SOLUTION: A radiation-resistant camera comprises a camera head 1 for capturing an image, and a camera body 2 for performing signal processing of a video signal. The camera head comprises an image sensor 3, a digital circuit 4, and a heat processing mechanism 5. The image sensor detects a video for distribution to a digital circuit, and the digital circuit processes the image signal from the image sensor and transmits the image signal to the camera body. The digital circuit and the image sensor are thermally separated from each other. The heat processing mechanism comprises a heater 6 and a characteristic deterioration detector 8. The characteristic deterioration detector detects electric characteristic deterioration of the digital circuit, and the heater performs heat treatment by heating the digital circuit in response to the electric characteristic deterioration of the digital circuit detected by the characteristic deterioration detector.SELECTED DRAWING: Figure 1 【課題】装置寿命の短縮やイメージセンサの暗電流増加を抑制しつつ、熱処理による耐放射線性向上とカメラヘッド部の小型・軽量化を両立する耐放射線カメラを提供する。【解決手段】画像を撮像するカメラヘッド部1と、映像信号を信号処理するカメラボディ部2とを有し、カメラヘッド部は、イメージセンサ3とデジタル回路4と熱処理機構5とを備え、イメージセンサは、映像を検出してデジタル回路に配信し、デジタル回路は、イメージセンサからの撮像信号を処理して、カメラボディ部に送信し、デジタル回路とイメージセンサとは熱的に分離され、熱処理機構は、ヒータ6と特性劣化検出器8とを備え、特性劣化検出器は、デジタル回路の電気特性劣化を検出し、ヒータは、特性劣化検出器が検出するデジタル回路の電気特性劣化に応じて、デジタル回路を加熱して熱処理する。【選択図】図1
Bibliography:Application Number: JP20220088275