CUTTING DEVICE

• Main Author: TAKENOUCHI KENJI
• Format: Patent
• Language: English; Japanese
• Published: 12.12.2023
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING

To provide a cutting device that can efficiently prevent chips from adhering to the device.SOLUTION: A cutting device 1 is configured to include: a chuck table 8a for holding a work-piece W; cutting means 9 that rotatably comprises a cutting blade 93 for cutting the work-piece W held on the chuck table 8a; X-axis feeding means that feeds the chuck table 8a and the cutting means 9 relatively in an X-axis direction for cutting; and Y-axis feeding means that indexing-feeds the chuck table 8a and the cutting means 9 relatively in a Y-axis direction which is orthogonal to the X-axis direction. The cutting device comprises: a cutting liquid supply nozzle 95 which is arranged adjacently to the cutting means 9, and supplies cutting liquid L2 to a contact point between the cutting blade 93 and the work-piece W; and a medicinal solution supply nozzle 96 that has a length exceeding a width P1 of the work-piece W in the Y-axis direction, and supplies a medicinal solution L1 for preventing adhesion of chips to a surface Wa of the work-piece W.SELECTED DRAWING: Figure 5 【課題】効率よく切削屑のデバイスへの付着を防止できる切削装置を提供する。【解決手段】被加工物Ｗを保持するチャックテーブル８ａと、チャックテーブル８ａに保持された被加工物Ｗを切削する切削ブレード９３を回転可能に備えた切削手段９と、チャックテーブル８ａと切削手段９とを相対的にＸ軸方向に切削送りするＸ軸送り手段と、チャックテーブル８ａと切削手段９とを相対的にＸ軸方向に直交するＹ軸方向に割り出し送りするＹ軸送り手段と、を含み構成される切削装置１であって、切削手段９に隣接して配設され、切削ブレード９３と被加工物Ｗとの接触点に切削液Ｌ２を供給する切削液供給ノズル９５と、被加工物Ｗの幅Ｐ１を超える長さをＹ軸方向に有し、被加工物Ｗの表面Ｗａに切削屑の付着を防止する薬液Ｌ１を供給する薬液供給ノズル９６と、を備える。【選択図】図５