CIRCUIT USING THREE-DIMENSIONAL WIRING, AND MANUFACTURE METHOD THEREFOR

• Main Authors: NAKADA MITSURU, MIYAKAWA MIKIJI, TSUJI HIROSHI
• Format: Patent
• Language: English; Japanese
• Published: 07.12.2023
• Subjects: ADVERTISING; BASIC ELECTRIC ELEMENTS; CRYPTOGRAPHY; DISPLAY; DISPLAYING; EDUCATION; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LABELS OR NAME-PLATES; PHYSICS; SEALS; SEMICONDUCTOR DEVICES; SIGNS

To suppress a defective electric connection from being caused and contact resistance from increasing between surface-side wiring and three-dimensional wiring of a film substrate.SOLUTION: In a pixel circuit 1 which drives a switching TFT 50, a driving TFT 51 and a light-emitting element 57 formed on a top surface side of a film substrate 101 using three-dimensional wiring 63 connecting a reverse-surface electrode 110 as reverse surface-side wiring of the film substrate 101 and a signal line 10 as top surface-side wiring, a scanning line 53, a ground line 54, and a power supply line 55, a contact electrode 11 which partially expands the width of the signal line 10 is formed halfway on the signal line 10 as an electrode for connecting the three-dimensional wiring 63. Consequently, the contact electrode 11 that the signal line 10 comprises can make the signal line 10 partially wider in width than a through hole 62 where the three-dimensional wiring 63 is formed.SELECTED DRAWING: Figure 2 【課題】フィルム基板の表面側配線と立体配線との間で、電気的な接続不良の発生及びコンタクト抵抗の増加を抑制する。【解決手段】フィルム基板１０１の裏面側配線である裏面電極１１０と表面側配線である信号線１０、走査線５３、グランド線５４及び電源線５５とを接続する立体配線６３を用いて、フィルム基板１０１の表面側に形成されたスイッチング用ＴＦＴ５０、ドライビング用ＴＦＴ５１及び発光素子５７を駆動する画素回路１において、信号線１０の途中に、立体配線６３を接続するための電極であって、信号線１０の幅を部分的に広げるコンタクト電極１１を形成する。これにより、信号線１０に備えたコンタクト電極１１において、信号線１０の幅を、立体配線６３が形成された貫通孔６２の幅よりも部分的に広げることができる。【選択図】図２