LOW-MOLD-CONTAMINATION SILICONE RUBBER COMPOSITION
To provide an addition-curable silicone rubber composition that minimizes mold contamination even subsequent to continuous molding of primary vulcanization.SOLUTION: A low-mold-contamination silicone rubber composition is an addition-curable silicone rubber composition that includes (A) a 3D network...
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Main Authors | , , |
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Format | Patent |
Language | English Japanese |
Published |
06.12.2023
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Subjects | |
Online Access | Get full text |
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Summary: | To provide an addition-curable silicone rubber composition that minimizes mold contamination even subsequent to continuous molding of primary vulcanization.SOLUTION: A low-mold-contamination silicone rubber composition is an addition-curable silicone rubber composition that includes (A) a 3D network-structured organopolysiloxane resin containing an alkenyl group, with R13SiO1/2 units and SiO4/2 units, the molar ratio of R13SiO1/2 units to SiO4/2 units being 0.5-1.5, (B) a linear organopolysiloxane having two or more alkenyl groups binding to silicon atoms in one molecule, (C) a linear organohydrogenpolysiloxane represented by the general formula (1) (where R2 is an alkyl group and R3 is an alkyl group or a hydrogen atom), (D) an organohydrogenpolysiloxane having two or more hydrosilyl groups in one molecule and one to three phenyl groups in one molecule, and (E) an addition reaction catalyst.SELECTED DRAWING: None
【課題】一次加硫の連続成形後でも、金型汚れが抑制される付加硬化性シリコーンゴム組成物を提供する。【解決手段】付加硬化性シリコーンゴム組成物であって、(A)R13SiO1/2単位とSiO4/2単位を有し、SiO4/2単位に対するR13SiO1/2単位のモル比が0.5~1.5であり、アルケニル基含有である三次元網状構造のオルガノポリシロキサンレジン、(B)ケイ素原子と結合するアルケニル基を1分子中に2個以上有する、直鎖状オルガノポリシロキサン、(C)下記一般式(1)で示される直鎖状オルガノハイドロジェンポリシロキサン、TIFF2023172173000011.tif23109(式中、R2はアルキル基であり、R3はアルキル基もしくは水素原子である)、(D)1分子中にヒドロシリル基を2個以上有し、1分子中に1~3個のフェニル基を有するオルガノハイドロジェンポリシロキサン、(E)付加反応触媒を含有するものである金型低汚染性シリコーンゴム組成物。【選択図】なし |
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Bibliography: | Application Number: JP20220083798 |