MOUNTING DEVICE

To provide a mounting device capable of accurately stabilizing a temperature while shortening an aging operation.SOLUTION: For an aging operation prior to a main mounting operation for mounting an electric component 100 onto a tape 300, a bonding head 2 and a bonding stage 3 are moved to an out-of-t...

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Bibliographic Details
Main Author HARA TOMOYUKI
Format Patent
LanguageEnglish
Japanese
Published 01.12.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:To provide a mounting device capable of accurately stabilizing a temperature while shortening an aging operation.SOLUTION: For an aging operation prior to a main mounting operation for mounting an electric component 100 onto a tape 300, a bonding head 2 and a bonding stage 3 are moved to an out-of-tape position 92 that is deviated from the tape 300. Then, the bonding head 2 and the bonding stage 3 are relatively contacted or approached at the out-of-tape position 92 while being heated by a head side heater 21, a stage side heater 31 and the like until a temperature is stabilized.SELECTED DRAWING: Figure 9 【課題】エージング作業を短縮しつつ、精度良く温度を安定化させることができる実装装置を提供する。【解決手段】ボンディングヘッド２とボンディングステージ３は、テープ３００に電子部品１００を実装する実装の本動作に先立つエージング動作として、テープ３００から外れたテープ外ポジション９２に移動する。そして、ボンディングヘッド２とボンディングステージ３は、テープ外ポジション９２で相対的に接触又は近接しながら、温度が安定するまでヘッド側ヒータ２１とステージ側ヒータ３１等により加熱される。【選択図】図９
Bibliography:Application Number: JP20230177913