PROCESSING STATE DETECTION METHOD, PROCESSING STATE DETECTION PROGRAM AND PROCESSING STATE DETECTION DEVICE

• Main Authors: DOI TAKASHI, NONAKA ATSUHIRO, SANKARUP DAYAL, KITAMURA TOMOKO, SHEKHAR HEMARF
• Format: Patent
• Language: English; Japanese
• Published: 01.12.2023
• Subjects: BASIC ELECTRIC ELEMENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT; DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINE TOOLS; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING

To provide a preprocessing device, a processing device, and a processing state detection device capable of detecting processing defects such as chipping leading to defects with high precision in real time.SOLUTION: Processing mark change data 34 associated with the temporal change of a processing mark is created on the basis of the imaging data of the processing mark imaged by a camera 30. In addition, a vibration sensor 40 detects the vibration of a disc-shaped grindstone 4 during the machining of a workpiece 10. Vibration change data 44 related to the temporal change of the vibration is created on the basis of primary data 42 of the vibration detected by the vibration sensor 40. The processing mark change data 34 and the vibration change data 44 are compared. By associating the change data 34 of the processing mark such as chipping leading to the defects with the change data 44 of the vibration, the defects of the processing mark corresponding to the chipping leading to the defects can be determined based on the change data 44 of the vibration.SELECTED DRAWING: Figure 3 【課題】欠陥につながるチッピングなどの加工不良をリアルタイムで精度良く検出することを可能とする予備加工装置、加工装置および加工状態検出装置を提供すること。【解決手段】カメラ３０により撮像した加工痕の撮像データから、加工痕の時間変化に関連する加工痕変化データ３４を作成する。また、振動センサ４０では、円盤状砥石４によるワーク１０への加工時の振動を検出する。振動センサ４０により検出した振動の一次データ４２から振動の時間変化に関連する振動変化データ４４を作成する。加工痕変化データ３４と振動変化データ４４とを比較する。欠陥につながるチッピングなどの加工痕の変化データ３４と、振動の変化データ４４を関連させることで、逆に振動の変化データ４４から、欠陥につながるチッピングなどに対応する加工痕の不良を判断することが可能になる。【選択図】図３