PRINTED WIRING BOARD

• Main Authors: YAMAMURA AKIHIRO, SHIMAZAKI KAZUNORI, SHINDO HIROYUKI, TOGASHI YASUHISA
• Format: Patent
• Language: English; Japanese
• Published: 29.11.2023
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

To provide a printed wiring board with excellent heat dissipation.SOLUTION: A printed wiring board (10) includes a core substrate (22) configured by laminating one or more insulating layers (26) and a plurality of conductor layers (28, 30), and a heat transfer member (34) installed vertically along the stacking direction of the core substrate, and further includes a build-up layer (24) laminated on at least one surface of the core substrate (22) and consisting of one or more insulating layers (44) and one or more conductive layers (46, 48), and the buildup layer (24) includes a heat transfer path (53) that transfers heat to and from the heat transfer member (34).SELECTED DRAWING: Figure 1 【課題】放熱性に優れるプリント配線板を提供。【解決手段】１層以上の絶縁層(26)および複数の導体層(28、30)を積層して構成されたコア基板(22)と、コア基板の積層方向にわたって立設された伝熱部材(34)とを有するプリント配線板(10)はさらに、コア基板(22)の少なくとも一方の表層面上に積層され１層以上の絶縁層(44)および１層以上の導体層(46、48)から構成されているビルドアップ層(24)を有し、ビルドアップ層（24）は伝熱部材(34)との間で熱を授受する伝熱路(53)を有する。【選択図】図１