CHIP PEELING DEVICE AND CHIP PEELING METHOD

• Main Authors: MOROISHI FUMITAKA, KAJINAMI MASAHITO, ISHIMOTO TATSUYA
• Format: Patent
• Language: English; Japanese
• Published: 24.11.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a chip peeling device which enables downsizing of the device and reduction of chips, and to provide a chip peeling method.SOLUTION: A chip peeling device 100 includes a housing 101 having a placing surface 111 capable of placing a wafer 10 thereon, having a recessed portion 113 and first vacuum suction holes 112 on the placing surface 111, and having second vacuum suction holes 115, blow holes 116, and protrusions 114 in the recessed portion 113. The chip peeling device further includes: a vacuum suction source 102 that evacuates the first vacuum suction holes 112 and the second vacuum suction holes 115; a pressure detector 105 that detects a degree of vacuum of the second vacuum suction holes 115; a pressurization source 107 that sends a fluid to the blow holes 116; a controller 106 that determines a flow rate of the fluid to be sent to the blow holes 116 based on the degree of vacuum; and a flow rate control valve 108 which controls a flow rate of the fluid to the flow rate determined by the controller 106. The controller 106 provides control to evacuate the second vacuum suction holes 115 and send the fluid to the blow holes 116.SELECTED DRAWING: Figure 1 【課題】装置を小型化でき、且つ欠けを低減できるチップ剥離装置及びチップ剥離方法を提供すること。【解決手段】チップ剥離装置１００は、ウェハ１０を載置可能な載置面１１１を有し、載置面１１１に凹部１１３と第１真空吸着穴１１２とを有し、凹部１１３に第２真空吸着穴１１５と、ブロウ穴１１６と、突起１１４とを有するハウジング１０１と、第１真空吸着穴１０２及び第２真空吸着穴１０５を真空引きする真空吸引源１０２と、第２真空吸着穴１０５の真空引きの真空度を検出する圧力検出器１０５と、ブロウ穴１１６に流体を送出する加圧源１０７と、真空度に基づいてブロウ穴１１６に送出する流体の流量を決定するコントローラ１０６と、流体を、コントローラ１０６の決定した流量に制御する流量制御弁１０８と、を備え、コントローラ１０６は、第２真空吸着穴１０５の真空引きを行うと共に、ブロウ穴６に流体を送出する制御を行う。【選択図】図１