LAMINATE ELECTRONIC COMPONENT
To provide a laminate electronic component.SOLUTION: A laminate electronic component includes a dielectric layer having a plurality of dielectric crystal grains. At least one of the dielectric crystal grains has a core-interface shell-shell structure. The dielectric crystal grain having a core-inter...
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Main Authors | , , |
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Format | Patent |
Language | English Japanese |
Published |
21.11.2023
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Subjects | |
Online Access | Get full text |
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Summary: | To provide a laminate electronic component.SOLUTION: A laminate electronic component includes a dielectric layer having a plurality of dielectric crystal grains. At least one of the dielectric crystal grains has a core-interface shell-shell structure. The dielectric crystal grain having a core-interface shell-shell structure includes a perovskite (ABO3)-based base material main component; a first sub-component containing Si; and a second sub-component including at least one selected from the group of Mn, V, Cr, Fe, Ni, Co, Cu, Zn, and Sn. The average content of the first sub-component is largest in a first interface shell region and the average content of the second sub-component is largest in a second interface shell region.SELECTED DRAWING: Figure 4
【課題】積層型電子部品に関する。【解決手段】誘電体層を含む積層型電子部品において、上記誘電体層は複数の誘電体結晶粒を含み、上記複数の誘電体結晶粒のうち少なくとも1つ以上は、コア-インターフェースシェル-シェル構造を有し、上記コア-インターフェースシェル-シェル構造を有する誘電体結晶粒は、ペロブスカイト(ABO3)系母材主成分、Siを含む第1副成分、並びにMn、V、Cr、Fe、Ni、Co、Cu、Zn及びSnからなる群から選択された1つ以上を含む第2副成分を含み、上記第1副成分の平均含有量は第1インターフェースシェル領域で最も高く、上記第2副成分の平均含有量は上記第2インターフェースシェル領域で最も高いことができる。【選択図】図4 |
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Bibliography: | Application Number: JP20230066023 |