TRAY

• Main Authors: MOYAMA KAZUKI, NAGASEKI KAZUYA
• Format: Patent
• Language: English; Japanese
• Published: 17.11.2023
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

To provide a technique that can place a semiconductor substrate in the correct position with respect to an edge ring.SOLUTION: A tray according to the present disclosure on which a semiconductor substrate is placed includes a substrate placement portion on which a semiconductor substrate is placed, and an edge ring placement portion that is provided around the substrate placement portion and on which an edge ring is placed. The substrate placement portion and the edge ring placement portion include a conductive tray body, and a dielectric film formed on at least the top surface of the tray body.SELECTED DRAWING: Figure 3 【課題】エッジリングに対して半導体基板を正しい位置に配置することができる技術を提供する。【解決手段】本開示は、半導体基板が載置されるトレイであって、半導体基板が載置される基板載置部と、基板載置部の周囲に設けられ、かつ、エッジリングが載置されるエッジリング載置部と、を有する。基板載置部およびエッジリング載置部は、導電性のトレイ本体と、トレイ本体の少なくとも上面に形成された誘電体膜と、を有する。【選択図】図３