COMPOSITE MATERIALS FOR DIELECTRIC APPLICATIONS

• Main Authors: COLIN CALABRESE, CHRISTINE HATTER, COLIN HAYES
• Format: Patent
• Language: English; Japanese
• Published: 10.11.2023
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

To provide composite materials for dielectric applications.SOLUTION: There is provided a dielectric composite material comprising (a) 20-50 wt.% of total solids of at least one thermosetting resin and other resin components; and (b) 50-70 wt.% of total solids of at least one inorganic particulate filler; where the at least one inorganic particulate filler is surface-modified with one or more acrylic-based silane coupling agents. 【課題】 誘電体用途向け複合材料を提供する。【解決手段】 （ａ）少なくとも１種の熱硬化性樹脂とその他の樹脂成分の総固形分を２０～５０重量％；及び（ｂ）少なくとも１種の無機微粒子フィラーの総固形分を５０～７０重量％；含む誘電体複合材料であって、少なくとも１種の無機微粒子フィラーが、１種以上のアクリル系シランカップリング剤で表面改質されている、誘電体複合材料が提供される。