RESIN COMPOSITION AND ALUMINA POWDER USED THEREFOR

• Main Authors: ARISE ICHIRO, UEMATSU HIROTO, NAKADA KUNIHIKO, NAKAYAMA ATSUSHI
• Format: Patent
• Language: English; Japanese
• Published: 10.11.2023
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

To provide a resin composition capable of improving heat dissipation characteristics without increasing the content of an alumina powder.SOLUTION: The resin composition contains a resin and an alumina powder. The alumina powder contains: first alumina particles having a particle diameter D50 of more than 100 μm and a BET specific surface area measured by a Krypton adsorption method of more than 0.085 m2/g; and second alumina particles having a particle diameter D50 of 0.1 μm or more and 1.0 μm or less.SELECTED DRAWING: None 【課題】アルミナ粉末の含有量を増加させずに、放熱特性を向上できる樹脂組成物を提供する。【解決手段】樹脂と、アルミナ粉末とを含む樹脂組成物であって、前記アルミナ粉末は、粒径Ｄ５０が１００μｍ超で、クリプトン吸着法により測定されたＢＥＴ比表面積が、０．０８５ｍ２/ｇ超の第１のアルミナ粒子と、粒径Ｄ５０が０．１μｍ以上１．０μｍ以下の第２のアルミナ粒子と、を含む、樹脂組成物。【選択図】なし