LASER PROCESSING DEVICE

• Main Author: YAEGASHI TAKAAKI
• Format: Patent
• Language: English; Japanese
• Published: 10.11.2023
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

To provide a laser processing device which can reduce sputters adhering to an emission unit.SOLUTION: A laser processing device 100 comprises: an emission unit 1 which emits a laser beam L in a first direction toward a workpiece W; a first aperture 2 which has a first hole 22 through which the laser beam L passes; a releasing unit 5 which releases a gas flow F intersecting the laser beam L on the emission unit 1 side of the first aperture 2; and a collection unit 6 which collects sputters S scattered from an irradiation point P of the laser beam L in the workpiece W. The releasing unit 5 is arranged on the opposite side of the collection unit 6 with the laser beam L held therebetween when viewed from the first direction.SELECTED DRAWING: Figure 1 【課題】本発明の目的は、出射部へ付着するスパッタを低減することが可能なレーザ加工装置を提供することである。【解決手段】レーザ加工装置１００は、ワークＷに向けて第１方向にレーザビームＬを出射する出射部１と、レーザビームＬが通過する第１孔２２を有する第１アパーチャ２と、第１アパーチャ２の出射部１側においてレーザビームＬと交差する気体流Ｆを放出する放出部５と、ワークＷにおけるレーザビームＬの照射点Ｐから飛散するスパッタＳを捕集するための捕集部６と、を備える。放出部５は、第１方向から視て、レーザビームＬを挟んで捕集部６の反対側に配置される。【選択図】図１