SEMICONDUCTOR DEVICE
To easily manufacture a semiconductor device.SOLUTION: A semiconductor device includes: a control circuit including a first conductivity-type semiconductor layer 33 and configured to drive a power transistor; a power terminal electrically connected to the semiconductor layer 33 and configured to be...
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Main Author | |
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Format | Patent |
Language | English Japanese |
Published |
09.11.2023
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Subjects | |
Online Access | Get full text |
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Summary: | To easily manufacture a semiconductor device.SOLUTION: A semiconductor device includes: a control circuit including a first conductivity-type semiconductor layer 33 and configured to drive a power transistor; a power terminal electrically connected to the semiconductor layer 33 and configured to be able to apply an operating voltage of the control circuit; a ground terminal electrically connected to the control circuit; and an ESD protection circuit 50 electrically connected to both of the power terminal and the ground terminal and configured to protect the control circuit from a current caused by static electricity applied to the power terminal. The ESD protection circuit 50 includes a protective transistor 51 using the semiconductor layer 33. The protective transistor 51 is a bipolar transistor composed of the semiconductor layer 33, a second conductivity-type first well region 61 formed on a front side surface 33s of the semiconductor layer 33, and a first conductivity-type second well region 62 formed on a front side surface of the first well region 61.SELECTED DRAWING: Figure 4
【課題】半導体装置を容易に製造すること。【解決手段】半導体装置は、第1導電型の半導体層33を有し、パワートランジスタを駆動する制御回路と、半導体層33と電気的に接続され、制御回路の動作電圧が印加可能に構成された電源端子と、制御回路と電気的に接続された接地端子と、電源端子と接地端子との双方に電気的に接続され、電源端子に印加する静電気に起因する電流から制御回路を保護するESD保護回路50と、を備える。ESD保護回路50は、半導体層33を用いた保護トランジスタ51を有する。保護トランジスタ51は、半導体層33と、半導体層33の表面33sに形成された第2導電型の第1ウェル領域61と、第1ウェル領域61の表面に形成された第1導電型の第2ウェル領域62と、によって構成されたバイポーラトランジスタである。【選択図】図4 |
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Bibliography: | Application Number: JP20220073407 |