COMPOSITION FOR FORMING INSULATING LAYER

• Main Authors: KUROKI TAKANOBU, WATANABE KENTA, KUME TETSUYA
• Format: Patent
• Language: English; Japanese
• Published: 08.11.2023
• Subjects: ADHESIVES; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; CORRECTING FLUIDS; DYES; FILLING PASTES; INKS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; POLISHES; USE OF MATERIALS THEREFOR; WOODSTAINS

To provide a coating composition for forming an insulating layer which has high-level storage stability, and can be inexpensively manufactured.SOLUTION: A composition for forming an insulating layer contains boehmite, binder and organic solvent, where the organic solvent includes first solvent selected from N-methyl-2-pyrrolidone, dimethylformamide, dimethylacetamide and dimethylsulfoxide, and second solvent selected from diols with a carbon number of 2 or more and 8 or less, and a mass ratio of the second solvent to the total mass of the first solvent and the second solvent is 2 mass% or more and 40 mass% or less.SELECTED DRAWING: None 【課題】高度の保存安定性を有し、安価に製造できる、絶縁膜形成用の塗料組成物を提供すること。【解決手段】ベーマイト、バインダー、及び有機溶媒を含有する、絶縁層形成用組成物であって、前記有機溶媒が、Ｎ－メチル－２－ピロリドン、ジメチルホルムアミド、ジメチルアセトアミド、及びジメチルスルホキシドから選択される第１溶媒と、炭素数２以上８以下のジオールから選択される第２溶媒とを含み、かつ、前記第１溶媒及び前記第２溶媒の合計質量に対する前記第２溶媒の質量割合が、２質量％以上４０質量％以下である、絶縁層形成用組成物。【選択図】なし