COMPOSITE PAD FOR CHEMICAL MECHANICAL POLISHING

• Main Authors: LIU ZHAN, CHIOU NAN-RONG, MICHAEL E MILLS
• Format: Patent
• Language: English; Japanese
• Published: 02.11.2023
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING

To provide chemical mechanical polishing and a pad useful for the chemical mechanical polishing.SOLUTION: A chemical mechanical polishing pad comprises a substantially non-porous polishing layer, the polishing layer comprising a polymer matrix and agglomerates of polymer particles embedded in the polymer matrix, where the polymer particles are present in an amount of 5 to 35 wt.% based on the weight of the polishing layer, the agglomerates have size greater than 1 μm, and the polymer particles have a tensile modulus higher than a tensile modulus of the polymer matrix. The polishing layer is viscoelastic and has a GEL greater than 1000 Pa-1. Polishing a metal/insulator composite with such a pad can reduce the amount of dishing of a metal feature.SELECTED DRAWING: None 【課題】化学機械研磨及び化学機械研磨に有用なパッドを提供する。【解決手段】実質的に無孔性の研磨層を含む化学機械研磨パッドであって、該研磨層が、ポリマーマトリックスと、該ポリマーマトリックス中に埋め込まれたポリマー粒子の凝集体（agglomerates）とを含み、該ポリマー粒子が、該研磨層の重量を基準にして５～３５重量％の量で存在し、該凝集体が１μmよりも大きいサイズを有し、該ポリマー粒子が、該ポリマーマトリックスの引張弾性率よりも高い引張弾性率を有する、化学機械研磨パッド。研磨層は粘弾性であり、１０００Pa-1より大きいＧＥＬを有する。金属／絶縁体の複合体をそのようなパッドで研磨すると、金属形体のディッシングの量を低下させることができる。【選択図】なし