RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATED PLATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE

• Main Authors: MURATA YUTA, KAKIYA MINORU, HATAKEYAMA NENE, TAKEGUCHI AYAKA, SATO NAOYOSHI, AKEBI RYUJI, FUKUI MASATO, TANIGAWA TAKAO
• Format: Patent
• Language: English; Japanese
• Published: 26.10.2023
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING-UP

To provide a resin composition which can achieve both low transmission loss and low thermal expansion, and a prepreg, a resin film, a laminated plate, a printed wiring board, and a semiconductor package, which are obtained using the resin composition.SOLUTION: A resin composition contains (A) a thermosetting resin, and (B) a thermoplastic resin, wherein (B) the thermoplastic resin contains at least one selected from the group consisting of (B1) a block copolymer having a block (b1) composed of a structural unit derived from an aromatic hydrocarbon compound, a block (b2) containing both a structural unit derived from a conjugated diene compound and a structural unit derived from an aromatic hydrocarbon compound, and a block (b3) composed of a structural unit derived from an aromatic hydrocarbon compound, and (B2) a random copolymer containing both a structural unit derived from a conjugated diene compound and a structural unit derived from an aromatic hydrocarbon compound.SELECTED DRAWING: None 【課題】低伝送損失化と低熱膨張性を両立し得る樹脂組成物を提供すること、並びに、当該樹脂組成物を用いて得られる、プリプレグ、樹脂フィルム、積層板、プリント配線板、及び半導体パッケージを提供すること。【解決手段】（Ａ）熱硬化性樹脂と、（Ｂ）熱可塑性樹脂と、を含有する樹脂組成物であって、前記（Ｂ）熱可塑性樹脂が、（Ｂ１）芳香族炭化水素化合物に由来する構造単位からなるブロック（ｂ１）と、共役ジエン化合物に由来する構造単位と芳香族炭化水素化合物に由来する構造単位とを共に含むブロック（ｂ２）と、芳香族炭化水素化合物に由来する構造単位からなるブロック（ｂ３）とを有するブロック共重合体及び（Ｂ２）共役ジエン化合物に由来する構造単位と芳香族炭化水素化合物に由来する構造単位とを共に含むランダム共重合体からなる群から選択される少なくとも１種を含む、樹脂組成物。【選択図】なし