THERMOSETTING RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATED PLATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE

• Main Authors: MURATA YUTA, KAKIYA MINORU, HATAKEYAMA NENE, TAKEGUCHI AYAKA, SATO NAOYOSHI, FUKUI MASATO, AKEBI RYUJI, TANIGAWA TAKAO
• Format: Patent
• Language: English; Japanese
• Published: 26.10.2023
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

To provide a thermosetting resin composition which can reduce lowest melt viscosity, and a prepreg, a resin film, a laminated plate, a printed wiring board, and a semiconductor package, which are obtained using the thermosetting resin composition.SOLUTION: A thermosetting resin composition contains (A) a thermosetting resin, and (B) an inorganic filler, wherein (B) the inorganic filler contains (B1) an inorganic filler having an average particle diameter b1 and standard deviation c1 of a particle diameter, and (B2) an inorganic filler having an average particle diameter b2 and standard deviation c2 of a particle diameter, and satisfies the following condition 1 and condition 2. Condition 1: b2/b1≤0.40, and condition 2: c1/b1≤0.20 and c2/b2≤0.20.SELECTED DRAWING: None 【課題】最低溶融粘度を低下させ得る熱硬化性樹脂組成物を提供すること、並びに、当該熱硬化性樹脂組成物を用いて得られる、プリプレグ、樹脂フィルム、積層板、プリント配線板、及び半導体パッケージを提供すること。【解決手段】（Ａ）熱硬化性樹脂及び（Ｂ）無機充填材を含有する熱硬化性樹脂組成物であって、前記（Ｂ）無機充填材は、（Ｂ１）平均粒子径ｂ１及び粒子径の標準偏差ｃ１の無機充填材と（Ｂ２）平均粒子径ｂ２及び粒子径の標準偏差ｃ２の無機充填材とを含み、且つ、下記条件１及び条件２を満たす、熱硬化性樹脂組成物。条件１：ｂ２／ｂ１≦０．４０条件２：ｃ１／ｂ１≦０．２０、且つ、ｃ２／ｂ２≦０．２０【選択図】なし