CLEANSER, CLEANING METHOD, AND FEEDING LIQUID

To provide a cleanser capable of removing organic materials or copper oxides adhered on a copper wiring surface, while suppressing etching of copper.SOLUTION: A cleanser includes a water-soluble carboxylic acid and hydrogen peroxide, a concentration of the hydrogen peroxide is less than 0.75 wt.%, a...

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Bibliographic Details
Main Authors HAYASHIZAKI MASAHIRO, AZUI MOMOKO, SADANAGA KOSUKE, TOJIMA MAMI
Format Patent
LanguageEnglish
Japanese
Published 26.10.2023
Subjects
ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES
CANDLES
CHEMICAL SURFACE TREATMENT
CHEMISTRY
CLEANING OR DEGREASING OF METALLIC MATERIAL BY CHEMICALMETHODS OTHER THAN ELECTROLYSIS
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DETERGENT COMPOSITIONS
DETERGENTS
DIFFUSION TREATMENT OF METALLIC MATERIAL
FATTY ACIDS THEREFROM
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
RECOVERY OF GLYCEROL
RESIN SOAPS
SOAP OR SOAP-MAKING
USE OF SINGLE SUBSTANCES AS DETERGENTS
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Summary:To provide a cleanser capable of removing organic materials or copper oxides adhered on a copper wiring surface, while suppressing etching of copper.SOLUTION: A cleanser includes a water-soluble carboxylic acid and hydrogen peroxide, a concentration of the hydrogen peroxide is less than 0.75 wt.%, and the pH is less than 2.5. Copper oxides can be removed from a surface of copper wiring using water-soluble carboxylic acid. Hydrogen peroxide can remove organic materials adhering to the surface of the copper wiring. This is because hydrogen peroxide reacts with water-soluble carboxylic acid in the cleanser, thereby producing percarboxylic acid. Etching of copper wiring can also be suppressed. This is considered to be because water-soluble carboxylic acid is adsorbed on a copper surface. Since it is less than 0.75 wt.%, etching can be further suppressed. Since the pH is less than 2.5, more copper oxide can be removed.SELECTED DRAWING: None 【課題】銅のエッチングを抑制しながら、銅配線表面に付着した有機物や銅酸化物を除去することができる洗浄剤を提供することを目的とする。【解決手段】洗浄剤は、水溶性カルボン酸と、過酸化水素とを含み、前記過酸化水素の濃度が０．７５重量％未満であり、ｐＨが２．５未満である。水溶性カルボン酸によって、銅配線表面から銅酸化物を除去することができる。過酸化水素によって、銅配線表面に付着した有機物を除去することができる。これは、洗浄剤中で、過酸化水素が水溶性カルボン酸と反応し、それによって過カルボン酸が生成するためである、と考えられる。銅配線のエッチングを抑制することもできる。これは、水溶性カルボン酸が銅表面に吸着するためである、と考えられる。０．７５重量％未満であるためエッチングをいっそう抑制することができる。ｐＨが２．５未満であるため、銅酸化物をいっそう除去することができる。【選択図】 なし
Bibliography:Application Number: JP20220066892