HEAT DISSIPATION MEMBER AND SEMICONDUCTOR MODULE

• Main Authors: MURAKAMI KOJI, YANAGITA YUKI
• Format: Patent
• Language: English; Japanese
• Published: 25.10.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a heat dissipation member that enhances the cooling performance of the heat dissipation member and restrain clogging of contaminants contained in cooling water, and a semiconductor module.SOLUTION: A heat dissipation member 5 includes a plate-shaped base portion 2 which expands in a first direction along a flow direction of refrigerant W and in a second direction perpendicular to the first direction, and has a thickness in a third direction perpendicular to the first direction and the second direction, and fins 1 protruding from the base portion 2 to one side surface 21 in the third direction. The fin 1 has a flat plate-shaped side wall portion 11 that expands in the first direction and the third direction with the second direction being set as a thickness direction. A side wall portion 11 is provided with a protruding portion 111 protruding in the second direction. The amount of protrusion of the protruding portion 111 in the second direction is equal to or less than half the distance between the side wall portions 11 of the fins 1 adjacent to each other in the second direction. The protruding portion 111 has an opposing surface facing the flow direction of the refrigerant W. The opposing surface has a rectangular shape that stands up from the side wall portion 11 in the second direction.SELECTED DRAWING: Figure 1 【課題】放熱部材の冷却性能の向上及び冷却水内に含まれるコンタミの詰まりを抑制する放熱部材及び半導体モジュールを提供する。【解決手段】放熱部材５は、冷媒Ｗが流れる方向に沿う第１方向、かつ第１方向に直交する第２方向に広がり、第１方向および第２方向に直交する第３方向に厚みを有する板形状のベース部２と、ベース部２から第３方向一方側面２１に突出するフィン１と、を有する。フィン１は、第１方向かつ第３方向に広がって第２方向を厚み方向とする平板状の側壁部１１を有する。側壁部１１には、第２方向に突出する突起部１１１が設けられる。突起部１１１の第２方向への突出量は、第２方向に隣り合う前記フィン１の前記側壁部１１間の間隔の半分以下である。突起部１１１は、冷媒Ｗが流れる方向と対向する対向面を有する。対向面は、側壁部１１から第２方向に起立する矩形状である。【選択図】図１