PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE

• Main Authors: TANAKA YUMA, KAWASAKI RITSUYA, KAWANAMI TAKUSHI
• Format: Patent
• Language: English; Japanese
• Published: 20.10.2023
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; ELECTROGRAPHY; HOLOGRAPHY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MATERIALS THEREFOR; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; THEIR PREPARATION OR CHEMICAL WORKING-UP

To provide a photosensitive resin composition capable of manufacturing a highly reliable electronic device by heating and curing the composition at approximately 170°C to form a cured film.SOLUTION: There is provided a photosensitive resin composition which comprises a polyamide resin and/or a polyimide resin, wherein a cured film obtained by heating the photosensitive resin composition at 170°C for 2 hours has a storage elastic modulus E'220 at 220°C of 0.5 to 3.0 GPa by measuring dynamic viscoelasticity under the following conditions. [Conditions] Frequency: 1 Hz, Temperature: 30 to 300°C, Temperature rising rate: 5°C/min, Measurement mode: Tensile mode.SELECTED DRAWING: Figure 1 【課題】１７０℃程度の加熱により硬化させて硬化膜とすることにより、信頼性の高い電子デバイスを製造可能な感光性樹脂組成物を提供することである。【解決手段】 ポリアミド樹脂および／またはポリイミド樹脂を含む感光性樹脂組成物であって、感光性樹脂組成物を１７０℃で２時間加熱して得られた硬化膜を、以下条件で動的粘弾性測定をしたときの、２２０℃での貯蔵弾性率Ｅ'２２０が０．５～３．０ＧＰａである、感光性樹脂組成物。［条件］周波数：１Ｈｚ温度：３０～３００℃昇温速度：５℃／分測定モード：引張りモード【選択図】図１