CURABLE RESIN COMPOSITION, LAMINATE STRUCTURE, CURED PRODUCT AND ELECTRONIC COMPONENT

• Main Authors: FUKUDA SHINICHIRO, KUDOU TOMOYA, CHA HANEUL
• Format: Patent
• Language: English; Japanese
• Published: 17.10.2023
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; ELECTROGRAPHY; HOLOGRAPHY; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MATERIALS THEREFOR; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; THEIR PREPARATION OR CHEMICAL WORKING-UP

To provide a curable resin composition capable of forming a cured product having a thickness of 10 μm or less and excellent in resolution and development resistance, wherein the resulting cured product not only has good insulation reliability but also has high rigidity and high adhesion to an insulated circuit board, a laminate structure using the curable resin composition, the cured product, and an electronic component.SOLUTION: A curable resin composition comprises (A) a carboxyl group-containing resin, (B) a photoinitiator, (C) a photo-curable compound containing no carboxyl group, (D) an inorganic filler, and (E) an epoxy resin, wherein as (C) the photo-curable compound containing no carboxyl group, (C-1) a photo-curable compound having a weight average molecular weight of 2,000 or more and (C-2) an oxyalkylene group-containing trifunctional photo-curable compound having a weight average molecular weight of less than 2,000.SELECTED DRAWING: None 【課題】厚さ１０μｍ以下の硬化物の形成が可能な硬化性樹脂組成物であって、解像性および耐現像性に優れ、得られた硬化物が良好な絶縁信頼性を有するだけでなく、高い剛性と回路基板との高い密着性を有する硬化性樹脂組成物、これを用いた積層構造体、硬化物および電子部品を提供すること。【解決手段】（Ａ）カルボキシル基含有樹脂、（Ｂ）光重合開始剤、（Ｃ）カルボキシル基を含有しない光硬化性化合物、（Ｄ）無機充填剤および（Ｅ）エポキシ樹脂を含有する硬化性樹脂組成物であって、（Ｃ）カルボキシル基を含有しない光硬化性化合物として、（Ｃ－１）重量平均分子量が２，０００以上の光硬化性化合物と、（Ｃ－２）重量平均分子量が２，０００未満であるオキシアルキレン基含有３官能光硬化性化合物と、を含む硬化性樹脂組成物。【選択図】なし