PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND PRINTED WIRING BOARD

• Main Authors: YANAGIDA NOBUYUKI, MATSUNO TAKUMI, MORI KANA
• Format: Patent
• Language: English; Japanese
• Published: 16.10.2023
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MATERIALS THEREFOR; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP

To provide a one-pack type photosensitive resin composition which has good room temperature storage stability and laminate property even if it is used as a resin layer of a dry film, and gives a cured product that has good solder heat resistance, gold plating resistance and insulation reliability even if it is cured at comparatively low temperature of 130°C.SOLUTION: A photosensitive resin composition contains (A) a carboxyl group-containing photosensitive resin, (B) a photopolymerizable monomer, (C) a photopolymerization initiator, and (D) an inorganic filler, wherein a content of chloride ions in a coating film composed of the photosensitive resin composition is 200 ppm or less.SELECTED DRAWING: None 【課題】一液型の感光性樹脂組成物であって、これをドライフィルムの樹脂層として用いた場合に室温保存安定性およびラミネート性が良好であり、かつ、当該感光性樹脂組成物を１３０℃と比較的低温で硬化した場合であっても、良好なはんだ耐熱性、金めっき耐性、絶縁信頼性を有する硬化物を与える、感光性樹脂組成物を提供する。【解決手段】（Ａ）カルボキシル基含有感光性樹脂と、（Ｂ）光重合性モノマーと、（Ｃ）光重合開始剤と、（Ｄ）無機フィラーと、を含有する感光性樹脂組成物であって、当該感光性樹脂組成物からなる塗膜中の塩化物イオン含有量が２００ｐｐｍ以下である感光性樹脂組成物。【選択図】なし