WAFER MOUNTING TABLE

To further improve thermal uniformity of a wafer.SOLUTION: A wafer mounting table 10 is provided with a cooling plate 30 having a coolant flow path 32 on a lower surface side of a ceramic plate 20 incorporating an electrode 22. A gas intermediate passage 50, which is a horizontal space, is provided...

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Bibliographic Details
Main Authors KUNO TATSUYA, INOUE SEIYA
Format Patent
LanguageEnglish
Japanese
Published 13.10.2023
Subjects
BASIC ELECTRIC ELEMENTS
CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERATION
SEMICONDUCTOR DEVICES
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Summary:To further improve thermal uniformity of a wafer.SOLUTION: A wafer mounting table 10 is provided with a cooling plate 30 having a coolant flow path 32 on a lower surface side of a ceramic plate 20 incorporating an electrode 22. A gas intermediate passage 50, which is a horizontal space, is provided in parallel with a wafer mounting surface 21 at a position closer to the wafer mounting surface 21 than the coolant flow path 32 inside the wafer mounting table 10, and has an overlapping portion that overlaps the coolant flow path along the coolant flow path 32 in a plan view.SELECTED DRAWING: Figure 2 【課題】ウエハの均熱性を更に改善する。【解決手段】ウエハ載置台１０は、電極２２を内蔵するセラミックプレート２０の下面側に、冷媒流路３２を有する冷却プレート３０が設けられたものである。水平スペースであるガス中間通路５０は、ウエハ載置台１０の内部のうち冷媒流路３２よりもウエハ載置面２１に近い位置にウエハ載置面２１と平行に設けられ、平面視で冷媒流路３２に沿って冷媒流路と重複する重複部を有する。【選択図】図２
Bibliography:Application Number: JP20220058341